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BC857CDW1T1G Anwendungshinweis - ON Semiconductor

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BC857CDW1T1G Anwendungshinweis

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Semiconductor Components Industries, LLC, 2011
November, 2011 Rev. 8
1 Publication Order Number:
BC856BDW1T1/D
BC856BDW1T1G,
SBC856BDW1T1GSeries,
BC857BDW1T1G,
SBC857BDW1T1GSeries,
BC858CDW1T1G Series
Preferred Devices
Dual General Purpose
Transistors
PNP Duals
These transistors are designed for general purpose amplifier
applications. They are housed in the SOT363/SC88 which is
designed for low power surface mount applications.
Features
AECQ101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage
BC856, SBC856
BC857, SBC857
BC858
V
CEO
65
45
30
V
CollectorBase Voltage
BC856, SBC856
BC857, SBC857
BC858
V
CBO
80
50
30
V
EmitterBase Voltage V
EBO
5.0 V
Collector Current Continuous I
C
100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation Per Device
FR5 Board (Note 1)
T
A
= 25C
Derate Above 25C
P
D
380
250
3.0
mW
mW/C
mW/C
Thermal Resistance,
JunctiontoAmbient
R
q
JA
328
C/W
Junction and Storage Temperature
Range
T
J
, T
stg
55 to +150 C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 = 1.0 x 0.75 x 0.062 in
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SOT363/SC88
CASE 419B
STYLE 1
MARKING DIAGRAM
Preferred devices are recommended choices for future use
and best overall value.
Q
1
(1)(2)
(3)
(4) (5) (6)
Q
2
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
3x = Specific Device Code
x = B, F, G, or L
(See Ordering Information)
M = Date Code
G =PbFree Package
3x MG
G
1
6
(Note: Microdot may be in either location)
Verzeichnis

BC857CDW1T1G Datenblatt-PDF

BC857CDW1T1G Datenblatt PDF
ON Semiconductor
7 Seiten, 118 KB
BC857CDW1T1G Anderes Datenblatt
ON Semiconductor
36 Seiten, 164 KB
BC857CDW1T1G Anwendungshinweis
ON Semiconductor
7 Seiten, 190 KB

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