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µIPM PQFN Technology AN-1168 Board Mounting Application Note
www.irf.com Version 12, June 2014 Page 1 of 23
Application Note AN-1168
Integrated Power Module (µIPM™)
Power Quad Flat No-Lead (PQFN)
Board Mounting Application Note
Table of Contents
Page
Device construction ................................................2
Design considerations ............................................3
Assembly considerations ........................................4
Mechanical test results ...........................................9
Appendix A Model-specific data .......................... 11
Appendix A.1 7x8 ................................................ 12
Appendix A.2 8x9 ................................................ 14
Appendix A.3 12x12 (27L) ................................... 16
Appendix A.4 12x12 (36L) ................................... 18
Appendix A.5 12x12 (37L) ................................... 20
Appendix A.6 12x12 (40L) ................................... 22
The PQFN package family comprises efficient devices with a wide range of input voltages, all of which
are lead-free as indicated by the PbF suffix after the part number (for example, IRFH3800PbF
). There
are various sizes and outlines. The main text of this application note contains guidance applicable to
the whole µIPM range of PQFN devices, while Appendix A contains device outlines, substrate layouts
and stencil designs for each device. For more detail about individual devices, refer to the relevant
product data sheet and package outline drawing. To simplify board mounting and improve reliability,
International Rectifier manufactures µIPM PQFN devices to exacting standards. These high standards
have evolved through evaluating many different materials and designs. Although such evaluations have
yielded good results, the recommendations in this application note may need to be adjusted to suit
specific production environments.
