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Application Report
SNVA009AG–September 1999–Revised August 2015
AN-1112 DSBGA Wafer Level Chip Scale Package
ABSTRACT
This application note provides information about the Die Size BGA (DSBGA) Wafer Level Chip Scale
Package (WLCSP).
Contents
1 Introduction ................................................................................................................... 3
2 Package Construction....................................................................................................... 3
3 DSBGA Package Data...................................................................................................... 4
4 Surface Mount Assembly Considerations ................................................................................ 5
5 PCB Layout................................................................................................................... 6
6 Stencil Printing Process..................................................................................................... 7
7 Component Placement...................................................................................................... 7
8 Solder Paste Reflow And Cleaning........................................................................................ 7
9 Rework ........................................................................................................................ 7
10 Qualification .................................................................................................................. 8
11 Thermal Characterization ................................................................................................. 15
12 DSBGA Do’s and Don’ts (Assuming NSMD pads) .................................................................... 16
Appendix A Mounting Conditions .............................................................................................. 19
Appendix B DSBGA Bump Site/Assembly Site Code Pin 1 Identification................................................ 20
List of Figures
1 DSBGA 4–25 Bump ......................................................................................................... 3
2 NSMD and SMD Pad Definition............................................................................................ 6
3 Thermal cycling profile specified for the −40 to 125°C profile with 5 minute ramp and 10 minute hold times... 8
4 Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package ................................................. 8
5 Pull Test Carried Out on the SMD 8 Bump (0.17 mm Diameter Bump) ............................................ 10
6 DSBGA 0.5 mm Pitch, 30 Bumps........................................................................................ 11
7 DSBGA 0.5mm Pitch, 16 Bumps, 0.275mm Bump Diameter......................................................... 11
8 DSBGA 0.4 mm Pitch, 36 Bumps........................................................................................ 12
9 DSBGA 0.4 mm Pitch, 64 Bumps........................................................................................ 12
10 DSBGA 0.35 mm Pitch, 64 Bumps ...................................................................................... 13
11 DSBGA 0.3 mm Pitch, 36 Bumps........................................................................................ 13
12 Board Deflection and Net Resistance (0.17 mm Diameter Bump Package) ....................................... 14
13 Flex Test PCB Layout ..................................................................................................... 15
14 Test Setup for Flexural Testing........................................................................................... 15
List of Tables
1 Package Arrays .............................................................................................................. 4
2 Bump Size Options.......................................................................................................... 4
3 Recommended PCB Pad Geometry — 0.4 & 0.5 mm pitch ........................................................... 6
4 Recommended PCB Pad Geometry — 0.3 & 0.35 mm pitch.......................................................... 6
5 Recommended Stencil Apertures .......................................................................................... 7
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SNVA009AG–September 1999–Revised August 2015 AN-1112 DSBGA Wafer Level Chip Scale Package
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Verzeichnis
- ・ Schweißen Temperatur on Seite 5
- ・ Anwendungsbereich on Seite 22
