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LSM6DS3US Anwendungshinweis - ST Microelectronics

  • Hersteller:
    ST Microelectronics
  • Beschreibung:
    iNEMO inertial module: 3D accelerometer and 3D gyroscope
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LSM6DS3US Anwendungshinweis

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October 2016
DocID029427 Rev 2
1/119
www.st.com
AN4889
Application note
LSM6DS3US: always-on 3D accelerometer and 3D gyroscope
Introduction
This application note is intended to provide usage information and application hints related to ST’s
iNEMO inertial module.
The LSM6DS3US is a 3D digital accelerometer and 3D digital gyroscope system-in-package with a
digital I
2
C/SPI serial interface standard output, performing at 0.85 mA in combo Normal mode and 1.1
mA (up to 1.6 kHz) in combo High-Performance mode. Thanks to the ultra-low noise performance of
both the gyroscope and the accelerometer, the device combines always-on low-power features with
superior sensing precision for an optimal motion experience for the consumer. Furthermore, the
accelerometer features smart sleep-to-wake-up (Activity) and return-to-sleep (Inactivity) functions that
allow advanced power saving.
The device has a dynamic user-selectable full-scale acceleration range of ±2/±4/±8/±16 g and an
angular rate range of ±125/±245/±500/±1000/±2000 dps.
The LSM6DS3US can be configured to generate interrupt signals by using hardware recognition of free-
fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, wake-up events.
The availability of different connection modes to external sensors allows implementing additional
functionalities such as a sensor hub, auxiliary SPI, etc.
The LSM6DS3US is compatible with the requirements of the leading OSs, offering real, virtual and
batch-mode sensors. It has been designed to implement in hardware significant motion, tilt, pedometer
functions, timestamp and to support the data acquisition of an external magnetometer with ironing
correction (hard, soft).
The LSM6DS3US has an integrated smart first-in first-out (FIFO) buffer of up to 8 kbyte size (4 kbyte for
FIFO + flexible 4kbyte for FIFO or for a custom program), allowing dynamic batching of significant data
(i.e. external sensors, step counter, timestamp and temperature).
The LSM6DS3US is available in a small plastic land grid array package (LGA-14L) and it is guaranteed
to operate over an extended temperature range from -40 °C to +85 °C.
The ultra-small size and weight of the SMD package make it an ideal choice for handheld portable
applications such as smartphones, IoT connected devices, and wearables or any other application
where reduced package size and weight are required.

LSM6DS3US Datenblatt-PDF

LSM6DS3US Datenblatt PDF
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LSM6DS3US Benutzerreferenzhandbuch
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LSM6DS3US Anderes Datenblatt
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LSM6DS3US Anwendungshinweis
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