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© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 7
1 Publication Order Number:
MC10EL31/D
MC10EL31, MC100EL31
5 V ECL D Flip‐Flop
With Set and Reset
Description
The MC10EL/100EL31 is a D flip-flop with set and reset. The
device is functionally equivalent to the E131 device with higher
performance capabilities. With propagation delays and output
transition times significantly faster than the E131, the EL31 is ideally
suited for those applications which require the ultimate in AC
performance.
Both set and reset inputs are asynchronous, level triggered signals.
Data enters the master portion of the flip-flop when clock is LOW and
is transferred to the slave, and thus the outputs, upon a positive
transition of the clock.
The 100 Series contains temperature compensation.
Features
• 475 ps Propagation Delay
• 2.8 GHz Toggle Frequency
• ESD Protection:
♦ > 1 kV Human Body Model
♦ > 100 V Machine Model
• PECL Mode Operating Range: V
CC
= 4.2 V to 5.7 V
with V
EE
= 0 V
• NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= −4.2 V to −5.7 V
• Internal Input Pulldown Resistors on D, CLK, S, and R
• Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
• Moisture Sensitivity:
♦ Level 1 for SOIC−8 NB
♦ Level 3 for TSSOP−8
♦ For Additional Information, see Application Note AND8003/D
• Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
• Metastability 125 ps (see Application Note AN1504)
• Transistor Count = 79 Devices
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
HL31
ALYWG
G
*For additional marking information, refer to
Application Note AND8002/D
.
MARKING DIAGRAMS*
KL31
ALYWG
G
SOIC−8 NB
D SUFFIX
CASE 751−05
TSSOP−8
DT SUFFIX
CASE 948R−02
1
8
1
8
ORDERING INFORMATION
www.onsemi.com
1
8
(Note: Microdot may be in either location)
KEL31
ALYW
G
1
8
1
8
HEL31
ALYW
G
1
8
H = MC10
K = MC100
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb-Free Package
See detailed ordering and shipping information on page 6 of
this data sheet.
SOIC−8 NB TSSOP−8
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 2
- ・ Abmessungen des Paketumrisses on Seite 7 Seite 8
- ・ Paket-Footprint-Pad-Layout on Seite 7
- ・ Teilenummerierungssystem on Seite 1 Seite 6 Seite 8
- ・ Markierungsinformationen on Seite 1 Seite 6 Seite 8
- ・ Typisches Anwendungsschaltbild on Seite 2
- ・ Technische Daten on Seite 6
- ・ Teilenummernliste on Seite 2
