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© Freescale Semiconductor, Inc., 2013. All rights reserved.
Freescale Semiconductor
Application Note
AN4613
Rev. 3.0, 5/2013
1 Introduction
The purpose of this application note is to define the standard
configuration and documentation requirement for packing
semiconductor product in embossed tape.
This document applies to all analog and power management
semiconductor devices assembled or tested by Freescale
Semiconductor as well devices assembled or tested by
subcontractor to Freescale Semiconductor.
Analog and Power Management Tape and Reel
Specification
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1 Device Orientation . . . . . . . . . . . . . . . . . . . . . 2
2.2 Specific device package orientation . . . . . . 3
2.3 Reel Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Part Number Suffix Codes . . . . . . . . . . . . . . . . 7
4 Terms and Definitions . . . . . . . . . . . . . . . . . . . 8
5 Reference Documents . . . . . . . . . . . . . . . . . . . 9
6 Revision History . . . . . . . . . . . . . . . . . . . . . . . 10
