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Freescale Semiconductor
Application Note
Document Number: AN3298
Rev. 0, 07/2006
Contents
© Freescale Semiconductor, Inc., 2006. All rights reserved.
1 Processability of
Integrated Circuits
JEDEC/IPC J-STD-020 (http://www.jedec.org) is a Joint
Industry Standard of Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State Surface
Mount Devices. This document demonstrates how to
determine the package temperature and thermal mass
dependent moisture sensitivity level (MSL) of products
to ensure reliable processing of moisture sensitive
surface mount components. Comply with these
recommendations to maintain package integrity of
components during any heat exposure of board soldering
and de-soldering.
The relevant temperature is measured at the top of the
parts and is defined as package peak temperature (PPT).
This package temperature is often also named peak
reflow temperature (PRT) which — because of reflow in
the technical term — can be misleading to take the
temperature in the solder joint where the material reflow
happens. It is important to note that the PPT is the
1 Processability of Integrated Circuits . . . . . . . . . . . . . . . . 1
2 Mixed Assemblies – Board Soldering of
Pb-free Terminated and Conventional Components . . . . 5
3 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Component Soldering with SnPb Solder Paste . . . . . . . . 7
5 Component Soldering with Pb-Free SnAgCu
Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Solder Joint Temperature and
Package Peak Temperature
Determining Thermal Limits during Soldering
