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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SXAEC
Rev. 3, 09/2017
MCIMX6XxAxxxxxB
MCIMX6XxAxxxxxC
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
© 2015-2017 NXP B.V.
1 Introduction
The i.MX 6SoloX automotive and infotainment
processors represent NXP Semiconductor’s latest
achievement in integrated multimedia-focused products
offering high-performance processing with a high degree
of functional integration. These processors are designed
considering the needs of the growing automotive
infotainment, telematics, HMI, and display-based cluster
markets.
The i.MX 6SoloX processor features NXP’s advanced
implementation of the single ARM
®
Cortex
®
-A9 core,
which operates at speeds of up to 800 MHz, in addition
to the ARM Cortex-M4 core, which operates at speeds of
up to 227 MHz. This type of heterogeneous multicore
architecture provides greater levels of system
integration, smart low-power system awareness, and fast
real-time responsiveness. The i.MX 6SoloX includes a
GPU processor capable of supporting 2D and 3D
i.MX 6SoloX Automotive
and Infot
ainment
Applications Processors
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .9
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Special Signal Considerations . . . . . . . . . . . . . . .19
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 21
4.2 Power Supplies Requirements and Restrictions . 34
4.3 Integrated LDO Voltage Regulator Parameters . .35
4.4 PLL Electrical Characteristics. . . . . . . . . . . . . . . . 37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 38
4.6 I/O DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . 39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters . . . . . . . . .47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 50
4.10 Multi-mode DDR Controller (MMDC) . . . . . . . . . .62
4.11 General-Purpose Media Interface (GPMI) Timing 63
4.12 External Peripheral Interface Parameters . . . . . . 71
4.13 A/D Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . 116
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 120
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . .120
5.2 Boot Device Interface Allocation . . . . . . . . . . . . 122
6 Package Information and Contact Assignments . . . . . 130
6.1 i.MX 6SoloX Signal Availability by Package. . . . 130
6.2 Signals with Different States During Reset and After
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
6.3 19x19 mm Package Information. . . . . . . . . . . . . 133
6.4 17x17 mm Package Information. . . . . . . . . . . . . 152
6.5 14x14 mm Package Information. . . . . . . . . . . . . 187
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
Verzeichnis
- ・ Abmessungen des Paketumrisses on Seite 19 Seite 35 Seite 130 Seite 131 Seite 132
- ・ Teilenummerierungssystem on Seite 3 Seite 4 Seite 5
- ・ Blockdiagramm on Seite 9
- ・ Technische Daten on Seite 18 Seite 21 Seite 22 Seite 23 Seite 83
- ・ Anwendungsbereich on Seite 2 Seite 3 Seite 4 Seite 5 Seite 6
- ・ Elektrische Spezifikation on Seite 21 Seite 22 Seite 23 Seite 24 Seite 25
