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© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 5
1 Publication Order Number:
NTD25P03L/D
NTD25P03L, STD25P03L
Power MOSFET
−25 A, −30 V, Logic Level P−Channel DPAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes.
The source−to−drain diode recovery time is comparable to a discrete
fast recovery diode.
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
• Bridge Circuits
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage V
DSS
−30 V
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp ≤ 10 ms)
V
GS
V
GSM
±15
±20
V
Vpk
Drain Current
− Continuous @ T
A
= 25°C
− Single Pulse (t
p
≤ 10 ms)
I
D
I
DM
−25
−75
A
Apk
Total Power Dissipation @ T
A
= 25°C P
D
75 W
Operating and Storage Temperature Range T
J
, T
stg
−55 to
+150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
J
= 25°C
(V
DD
= 25 Vdc, V
GS
= 5.0 Vdc,
Peak I
L
= 20 Apk, L = 1.0 mH, R
G
= 25 W)
E
AS
200 mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
q
JC
R
q
JA
R
q
JA
1.65
67
120
°C/W
Maximum Lead Temperature for Soldering
Purposes, (1/8 in from case for 10 seconds)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
MARKING DIAGRAM
& PIN ASSIGNMENT
A = Assembly Location*
Y = Year
WW = Work Week
25P03L = Device Code
G = Pb−Free Package
See detailed ordering and shipping information on page 7 o
f
this data sheet.
ORDERING INFORMATION
D
S
G
P−Channel
−30 V
51 mW @ 5.0 V
R
DS(on)
Typ
−25 A
I
D
MaxV
(BR)DSS
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369C
STYLE 2
AYWW
25P
03LG
1
2
3
4
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 1
- ・ Abmessungen des Paketumrisses on Seite 8
- ・ Paket-Footprint-Pad-Layout on Seite 8
- ・ Teilenummerierungssystem on Seite 1 Seite 7 Seite 8
- ・ Markierungsinformationen on Seite 1 Seite 8
- ・ Typisches Anwendungsschaltbild on Seite 1
- ・ Technische Daten on Seite 7
- ・ Anwendungsbereich on Seite 1 Seite 7
- ・ Elektrische Spezifikation on Seite 2 Seite 3 Seite 7
- ・ Teilenummernliste on Seite 1
