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TIP31AG Anwendungshinweis - ON Semiconductor

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TIP31AG Anwendungshinweis

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© Semiconductor Components Industries, LLC, 2013
September, 2013 − Rev. 14
1 Publication Order Number:
TIP31A/D
TIP31G, TIP31AG, TIP31BG,
TIP31CG (NPN),
TIP32G,TIP32AG, TIP32BG,
TIP32CG(PNP)
Complementary Silicon
Plastic Power Transistors
Designed for use in general purpose amplifier and switching
applications.
Features
High Current Gain − Bandwidth Product
Compact TO−220 Package
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage
TIP31G, TIP32G
TIP31AG, TIP32AG
TIP31BG, TIP32BG
TIP31CG, TIP32CG
V
CEO
40
60
80
100
Vdc
Collector−Base Voltage
TIP31G, TIP32G
TIP31AG, TIP32AG
TIP31BG, TIP32BG
TIP31CG, TIP32CG
V
CB
40
60
80
100
Vdc
Emitter−Base Voltage V
EB
5.0 Vdc
Collector Current − Continuous I
C
3.0 Adc
Collector Current − Peak I
CM
5.0 Adc
Base Current I
B
1.0 Adc
Total Power Dissipation
@ T
C
= 25°C
Derate above 25°C
P
D
40
0.32
W
W/°C
Total Power Dissipation
@ T
A
= 25°C
Derate above 25°C
P
D
2.0
0.016
W
W/°C
Unclamped Inductive Load Energy
(Note 1)
E 32 mJ
Operating and Storage Junction
Temperature Range
T
J
, T
stg
65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. I
C
= 1.8 A, L = 20 mH, P.R.F. = 10 Hz, V
CC
= 10 V, R
BE
= 100 W
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient
R
q
JA
62.5 °C/W
Thermal Resistance, Junction−to−Case
R
q
JC
3.125 °C/W
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
TO−220
CASE 221A
STYLE 1
MARKING DIAGRAM
3 AMPERE
POWER TRANSISTORS
COMPLEMENTARY SILICON
40−60−80−100 VOLTS,
40 WATTS
http://onsemi.com
1
2
3
4
TIP3xx = Device Code
xx = 1, 1A, 1B, 1C,
2, 2A, 2B, 2C,
A = Assembly Location
Y = Year
WW = Work Week
G Pb−Free Package
TIP3xxG
AYWW
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
1
BASE
3
EMITTER
COLLECTOR
2,4
1
BASE
3
EMITTER
COLLECTOR
2,4
NPNPNP
Verzeichnis

TIP31AG Datenblatt-PDF

TIP31AG Datenblatt PDF
ON Semiconductor
10 Seiten, 135 KB
TIP31AG Anderes Datenblatt
ON Semiconductor
11 Seiten, 514 KB
TIP31AG Diagramme zeichnen
ON Semiconductor
2 Seiten, 31 KB
TIP31AG Anwendungshinweis
ON Semiconductor
7 Seiten, 129 KB
TIP31AG Notizdatei
ON Semiconductor
5 Seiten, 159 KB

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