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TIP31G Anwendungshinweis - ON Semiconductor

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TIP31G Anwendungshinweis

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© Semiconductor Components Industries, LLC, 2011
September, 2011 Rev. 13
1 Publication Order Number:
TIP31A/D
TIP31, TIP31A, TIP31B,
TIP31C, (NPN), TIP32,
TIP32A, TIP32B, TIP32C,
(PNP)
Complementary Silicon
Plastic Power Transistors
Designed for use in general purpose amplifier and switching
applications.
Features
CollectorEmitter Saturation Voltage
V
CE(sat)
= 1.2 Vdc (Max) @ I
C
= 3.0 Adc
CollectorEmitter Sustaining Voltage
V
CEO(sus)
= 40 Vdc (Min) TIP31, TIP32
= 60 Vdc (Min) TIP31A, TIP32A
= 80 Vdc (Min) TIP31B, TIP32B
= 100 Vdc (Min) TIP31C, TIP32C
High Current Gain Bandwidth Product
f
T
= 3.0 MHz (Min) @ I
C
= 500 mAdc
Compact TO220 AB Package
PbFree Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector Emitter Voltage TIP31, TIP32
TIP31A, TIP32A
TIP31B, TIP32B
TIP31C, TIP32C
V
CEO
40
60
80
100
Vdc
CollectorBase Voltage TIP31, TIP32
TIP31A, TIP32A
TIP31B, TIP32B
TIP31C, TIP32C
V
CB
40
60
80
100
Vdc
EmitterBase Voltage V
EB
5.0 Vdc
Collector Current Continuous
Peak
I
C
3.0
5.0
Adc
Base Current I
B
1.0 Adc
Total Power Dissipation
@ T
C
= 25°C
Derate above 25°C
P
D
40
0.32
W
W/°C
Total Power Dissipation
@ T
A
= 25°C
Derate above 25°C
P
D
2.0
0.016
W
W/°C
Unclamped Inductive Load Energy (Note 1) E 32 mJ
Operating and Storage Junction
Temperature Range
T
J
, T
stg
65 to
+ 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. I
C
= 1.8 A, L = 20 mH, P.R.F. = 10 Hz, V
CC
= 10 V, R
BE
= 100 W
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
TO220AB
CASE 221A
STYLE 1
MARKING
DIAGRAM
3 AMPERE
POWER TRANSISTORS
COMPLEMENTARY SILICON
406080100 VOLTS,
40 WATTS
http://onsemi.com
1
2
3
4
TIP3xx = Device Code
xx = 1, 1A, 1B, 1C,
2, 2A, 2B, 2C,
A = Assembly Location
Y = Year
WW = Work Week
GPbFree Package
TIP3xxG
AYWW
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
Verzeichnis

TIP31G Datenblatt-PDF

TIP31G Datenblatt PDF
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TIP31G Anderes Datenblatt
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TIP31G Diagramme zeichnen
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2 Seiten, 31 KB
TIP31G Anwendungshinweis
ON Semiconductor
7 Seiten, 119 KB
TIP31G Eigenschaften Beschreibung Parameter
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6 Seiten, 311 KB
TIP31G Notizdatei
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5 Seiten, 159 KB
TIP31G Andere Referenzen
ON Semiconductor
1 Seiten, 136 KB

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