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Caution Electro-static sensitive devices
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BIPOLAR ANALOG INTEGRATED CIRCUITS
µ
µµ
µ
PC2745TB,
µ
µµ
µ
PC2746TB
3 V, SUPER MINIMOLD SILICON MMIC
WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
1996, 2001©
Document No. P11511EJ3V0DS00 (3rd edition)
Date Published February 2001 N CP(K)
Printed in Japan
DATA SHEET
The mark shows major revised points.
DESCRIPTION
The
µ
PC2745TB and
µ
PC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile
communications. These low current amplifiers operate on 3.0 V (1.8 V MIN.).
These ICs are manufactured using NEC’s 20 GHz f
T
NESATIII silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
FEATURES
• Supply voltage : Recommended V
CC
= 2.7 to 3.3 V
Circuit operation V
CC
= 1.8 to 3.3 V
• Upper limit operating frequency :
µ
PC2745TB; f
u
= 2.7 GHz
TYP.@3 dB bandwidth
µ
PC2746TB; f
u
= 1.5 GHz TYP.@3 dB bandwidth
• High isolation :
µ
PC2745TB; ISL = 38 dB
TYP.@f = 500 MHz
µ
PC2746TB; ISL = 45 dB
TYP.@f = 500 MHz
• Power gain :
µ
PC2745TB; G
P
= 12 dB
TYP.@f = 500 MHz
µ
PC2746TB; G
P
= 19 dB
TYP.@f = 500 MHz
• Saturated output power :
µ
PC2745TB; P
O(sat)
= −1 dBm
TYP.@f = 500 MHz
µ
PC2746TB; P
O(sat)
= 0 dBm
TYP.@f = 500 MHz
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATION
• 1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.):
µ
PC2745TB
• 800 MHz to 900 MHz cellular telephone (CT2, GSM, etc.) :
µ
PC2746TB
ORDERING INFORMATION
Part Number Package Marking Supplying Form
µ
PC2745TB-E3 6-pin super minimold C1Q
µ
PC2746TB-E3 C1R
• Embossed tape 8 mm wide
• 1, 2, 3 pins face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your local NEC sales office.
Part number:
µ
PC2745TB,
µ
PC2746TB
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 2
- ・ Abmessungen des Paketumrisses on Seite 16
- ・ Teilenummerierungssystem on Seite 1
- ・ Markierungsinformationen on Seite 1 Seite 2 Seite 7
- ・ Blockdiagramm on Seite 2
- ・ Schweißen Temperatur on Seite 17
- ・ Technische Daten on Seite 4
- ・ Anwendungsbereich on Seite 3 Seite 7
- ・ Elektrische Spezifikation on Seite 2 Seite 4
