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APPLICATION NOTES for THROUGH-HOLE LEDs
STORAGE CONDITIONS
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid
transitions in ambient temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
4. The LED leadframe surface is plated with silver. When the leadframe is stored under high-humidity
environments, or exposed to certain chemical elements or gases, the surface may become discolored.
Please maintain the cleanliness of the storage environment.
5. If the storage conditions do not meet specication standards, the component pins may become oxidized
requiring re-plating and re-sorting before use. Suggest customers consume LEDs as soon as possible, and
avoid long-term storage of large inventories.
LED MOUNTING METHOD
1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component
placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the
gure below for proper lead forming procedures.
“○”
Correct mounting method “X” Incorrect mounting method
Note: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits.
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to
prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED
