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SLRA003D Aug 2014, revised July 2016 Page 1
FemtoFET™ Surface Mount Guide
Texas Instrument (TI) is facilitating the
electronics industry’s drive towards smaller
packaging outline technologies with the
FemtoFET
TM
series of packages. The
FemtoFET
TM
is a Land Grid Array (LGA)
package, which is a silicon Chip Scale
Package with metallized pads instead of
solder balls. This document describes the
Surface Mount Technology (SMT) issues
to be considered when attaching these
parts to printed circuit boards.
The FemtoFET
TM
package series is
targeted toward handheld and mobile
applications where small form factor,
space, and weight limitations
are essential.
This technology is capable of replacing
standard small signal MOSFETs, providing
a 70% reduction in footprint size. For more
information, visit: www.ti.com
F3(YJM) F4(YJC)
F4 (YJJ) F5(YJK)
Device Name Suffix
F3 F4 F4 F5
Package Designator YJM YJC YJJ YJK
Package Width (W)* 0.60 0.60 0.60 0.73
Package Length (L)* 0.69 1.00 1.00 1.49
Package Thickness (Max) 0.35 0.35 0.20 0.35
* Nominal dimensions shown. All measurements in mm.
For additional information, see package designator at
www.ti.com
Operation Assembly Quick Start Checklist
Solder Paste
TI recommends the use of type 3 or finer solder paste when mounting the FemtoFET
TM
devices. Either no-clean or water-soluble solder paste is acceptable.
TI recommends inspection of solder paste printing quality by SPI (solder paste inspection)
machine.
Reflow
Profile
Measure the peak reflow temperature by placing a fine gauge thermocouple (Type K) on top
of the package body center.
Ensure that the peak reflow temperature does not exceed 260°C max. (260°C +0/- 5°C)
Exceeding the max temperature may damage the part.
Reflow time within 5°C Peak Temp must not exceed 20 seconds and the reflow time above
liquidus must not exceed 60 seconds.
Minimizing the number of reflow cycles seen by the FemtoFET
TM
devices is recommended.
Moisture
Handling
FemtoFET
TM
products are classified as MSL1 and require no special handling due to
moisture sensitivity. MSL1 parts are not limited by max floor exposure.
See IPC/JED
EC J-STD-033 for additional details.
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