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1 TMS320C6727, TMS320C6726, TMS320C6722 DSPs
1.1 Features
TMS320C6727, TMS320C6726, TMS320C6722
Floating-Point Digital Signal Processors
SPRS268E – MAY 2005 – REVISED JANUARY 2007
• C672x: 32-/64-Bit 300-MHz Floating-Point DSPs • Three Multichannel Audio Serial Ports
– Transmit/Receive Clocks up to 50 MHz
• Upgrades to C67x+ CPU From C67x™ DSP
– Six Clock Zones and 16 Serial Data Pins
Generation:
– Supports TDM, I2S, and Similar Formats
– 2X CPU Registers [64 General-Purpose]
– DIT-Capable (McASP2)
– New Audio-Specific Instructions
– Compatible With the C67x CPU
• Universal Host-Port Interface (UHPI)
– 32-Bit-Wide Data Bus for High Bandwidth
• Enhanced Memory System
– Muxed and Non-Muxed Address and Data
– 256K-Byte Unified Program/Data RAM
– 384K-Byte Unified Program/Data ROM
• Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin
– Single-Cycle Data Access From CPU Options
– Large Program Cache (32K Byte) Supports
• Two Inter-Integrated Circuit (I2C) Ports
RAM, ROM, and External Memory
• Real-Time Interrupt Counter/Watchdog
• External Memory Interface (EMIF) Supports
• Oscillator- and Software-Controlled PLL
– 100-MHz SDRAM (16- or 32-Bit)
• Applications:
– Asynchronous NOR Flash, SRAM (8-,16-, or
– Professional Audio
32-Bit)
• Mixers
– NAND Flash (8- or 16-Bit)
• Effects Boxes
• Enhanced I/O System
• Audio Synthesis
– High-Performance Crossbar Switch
• Instrument/Amp Modeling
– Dedicated McASP DMA Bus
• Audio Conferencing
– Deterministic I/O Performance
• Audio Broadcast
• dMAX (Dual Data Movement Accelerator)
• Audio Encoder
Supports:
– Emerging Audio Applications
– 16 Independent Channels
– Biometrics
– Concurrent Processing of Two Transfer
– Medical
Requests
– Industrial
– 1-, 2-, and 3-Dimensional
• Commercial or Extended Temperature
Memory-to-Memory and
Memory-to-Peripheral Data Transfers
• 144-Pin, 0.5-mm, PowerPAD™ Thin Quad
– Circular Addressing Where the Size of a Flatpack (TQFP) [RFP Suffix]
Circular Buffer (FIFO) is not Limited to 2
n
• 256-Terminal, 1.0-mm, 16x16 Array Plastic Ball
– Table-Based Multi-Tap Delay Read and
Grid Array (PBGA) [GDH and ZDH Suffixes]
Write Transfers From/To a Circular Buffer
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.
Philips is a registered trademark of Koninklijki Philips Electronics N.V.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 19
- ・ Abmessungen des Paketumrisses on Seite 111
- ・ Blockdiagramm on Seite 5 Seite 12 Seite 40 Seite 68 Seite 80
- ・ Technische Daten on Seite 33 Seite 34 Seite 35 Seite 36 Seite 37
- ・ Anwendungsbereich on Seite 1 Seite 114
- ・ Elektrische Spezifikation on Seite 33 Seite 34 Seite 35 Seite 36 Seite 37
