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TMS320DM335
www.ti.com
SPRS528C–JULY 2008–REVISED JUNE 2010
TMS320DM335
Digital Media System-on-Chip (DMSoC)
Check for Samples: TMS320DM335
1 Digital Media System-on-Chip (DMSoC)
1.1 TMS320DM335 Features
123
– EmbeddedICE-RT™ Logic for Real-Time
• Highlights
Debug
– High-Performance Digital Media
• ARM9 Memory Architecture
System-On-Chip (DMSoC)
– 16K-Byte Instruction Cache
– Up to 216-MHz ARM926EJ-S™ Clock Rate
– 8K-Byte Data Cache
– Digital HDTV (720p/1080i) output for
connection to external encoder – 32K-Byte RAM
– Video Processing Subsystem – 8K-Byte ROM
• Hardware IPIPE for Real-Time Image – Little Endian
Processing
• Video Processing Subsystem
• Up to 14-bit CCD/CMOS Digital Interface
– Front End Provides:
• Histogram Module
• Hardware IPIPE for Real-Time Image
• Resize Image 1/16x to 8x Processing
• Hardware On-Screen Display • Up to 14-bit CCD/CMOS Digital Interface
• Up to 75-MHz Pixel Clock • 16-/8-bit Generic YcBcR-4:2 Interface
(BT.601)
• Composite NTSC/PAL video encoder
output • 10-/8-bit CCIR6565/BT655 Interface
– Peripherals include DDR and mDDR SDRAM, • Up to 75-MHz Pixel Clock
2 MMC/SD/SDIO and SmartMedia Flash Card
• Histogram Module
Interfaces, USB 2.0, 3 UARTs and 3 SPIs
• Resize Engine
– Enhanced Direct-Memory-Access (EDMA)
– Resize Images From 1/16x to 8x
– Configurable Power-Saving Modes
– Separate Horizontal/Vertical Control
– On-Chip ARM ROM Bootloader (RBL) to Boot
– Two Simultaneous Output Paths
From NAND Flash, MMC/SD, or UART
– Back End Provides:
– 3.3-V and 1.8-V I/O, 1.3-V Core
• Hardware On-Screen Display (OSD)
– Debug Interface Support
• Composite NTSC/PAL video encoder
– Up to 104 General-Purpose I/O (GPIO) Pins
output
– 337-Pin Ball Grid Array at 65 nm Process
• 8-/16-bit YCC and Up to 18-Bit RGB666
Technology
Digital Output
• High-Performance Digital Media
• BT.601/BT.656 Digital YCbCr 4:2:2
System-on-Chip (DMSoC)
(8-/16-Bit) Interface
– 135-, 216-MHz ARM926EJ-S™ Clock Rate
• Digital HDTV (720p/1080i) output for
– Fully Software-Compatible With ARM™
connection to external encoder
– Extended Temperature 135- and 216-MHz
• External Memory Interfaces (EMIFs)
Devices are Available
– DDR2 and mDDR SDRAM 16-bit wide EMIF
• ARM926EJ-S Core
With 256 MByte Address Space (1.8-V I/O)
– Support for 32-Bit and 16-Bit (Thumb Mode)
– Asynchronous16-/8-bit Wide EMIF (AEMIF)
Instruction Sets
• Flash Memory Interfaces
– DSP Instruction Extensions and Single Cycle
– NAND (8-/16-bit Wide Data)
MAC
– OneNAND(16-bit Wide Data)
– ARM® Jazelle® Technology
• Flash Card Interfaces
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Windows is a trademark of Microsoft.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 10 Seite 14 Seite 37 Seite 38 Seite 39
- ・ Abmessungen des Paketumrisses on Seite 157
- ・ Markierungsinformationen on Seite 157 Seite 158
- ・ Blockdiagramm on Seite 4 Seite 62 Seite 68 Seite 87
- ・ Typisches Anwendungsschaltbild on Seite 59
- ・ Technische Daten on Seite 95 Seite 98 Seite 99 Seite 100 Seite 101
- ・ Anwendungsbereich on Seite 160
- ・ Elektrische Spezifikation on Seite 97 Seite 98 Seite 99 Seite 100 Seite 101
