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TPS82695EVM-646 Benutzerreferenzhandbuch - TI

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TPS82695EVM-646 Benutzerreferenzhandbuch

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User's Guide
SLVU383DOctober 2010 Revised November 2011
TPS826xxEVM
This users guide describes the characteristics, operation, and use of the TPS826xxEVM-646 evaluation
module (EVM). The TPS826xxEVM-646 is a fully assembled and tested platform for evaluating the
performance of the TPS82671, TPS82672, TPS82675, TPS82690 and TPS82695 high-frequency,
synchronous, step-down dc-dc converters optimized for battery-powered portable applications. This
document includes schematic diagrams, a printed circuit board (PCB) layout, bill of materials, and test
data. Throughout this document, the abbreviations EVM and TPS826xxEVM and the term evaluation
module are synonymous with the TPS826xxEVM-646 unless otherwise noted.
Contents
1 Introduction .................................................................................................................. 2
1.1 Features ............................................................................................................. 2
1.2 Applications ......................................................................................................... 2
1.3 EVM Ordering Options ............................................................................................ 2
2 TPS826xxEVM Schematic ................................................................................................. 3
3 Connector and Test Point Descriptions .................................................................................. 3
3.1 Input / Output Connectors: TPS826xxEVM ..................................................................... 3
3.2 Jumpers and Switches ............................................................................................ 4
4 Test Configuration .......................................................................................................... 5
4.1 Hardware Setup .................................................................................................... 5
4.2 Procedure ........................................................................................................... 5
5 TPS826xxEVM Test Data .................................................................................................. 6
5.1 Thermal Performance ............................................................................................. 6
6 TPS826xxEVM Assembly Drawings and Layout ....................................................................... 8
7 Bill of Materials ............................................................................................................. 11
8 Marking Information ....................................................................................................... 11
List of Figures
1 TPS826xxEVM Schematic................................................................................................. 3
2 Hardware Board Connection .............................................................................................. 5
3 Top Side Thermal Measurement.......................................................................................... 6
4 Bottom Side Thermal Measurement...................................................................................... 7
5 TPS826xxEVM Component Placement (Top View).................................................................... 8
6 TPS826xxEVM Top-Side Copper (Top View)........................................................................... 9
7 TPS826xxEVM Bottom-Side Copper (Bottom View).................................................................. 10
Bluetooth is a registered trademark of Bluetooth SIG.
All other trademarks are the property of their respective owners.
1
SLVU383DOctober 2010Revised November 2011 TPS826xxEVM
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Copyright © 20102011, Texas Instruments Incorporated
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TPS82695EVM-646 Datenblatt-PDF

TPS82695EVM-646 Datenblatt PDF
TI
26 Seiten, 1419 KB
TPS82695EVM-646 Benutzerreferenzhandbuch
TI
13 Seiten, 567 KB

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