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K10P121M100SF2V2
K10 Sub-Family
Supports the following:
MK10DN512VMC10
Features
•
Operating Characteristics
–
Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
•
Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
•
Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
•
Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
•
System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 63
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
•
Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
•
Human-machine interface
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
•
Analog modules
– Two 16-bit SAR ADCs
– Programmable gain amplifier (PGA) (up to x64)
integrated into each ADC
– Two 12-bit DACs
– Two transimpedance amplifiers
– Three analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
•
Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two 2-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
•
Communication interfaces
– Two Controller Area Network (CAN) modules
– Three SPI modules
– Two I2C modules
– Six UART modules
– Secure Digital host controller (SDHC)
– I2S module
Freescale Semiconductor
Document Number: K10P121M100SF2V2
Data Sheet: Technical Data
Rev. 3, 6/2013
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2012–2013 Freescale Semiconductor, Inc.
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