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TPS62366x
PGND
PGND
PGND
AGND
SW
SW
LOAD
C
OUT
0.1µF
SENSE-
SENSE+
VIN
SCL
SDA
VSEL
EN
AVIN
VDD
2.5V .. 5.5V
0.47uH / 1µH
10µF
VIN
0.1µF
1mm
TPS62366A, TPS62366B
www.ti.com
SLUSAX3 –JULY 2012
4A Processor Supply with I
2
C Compatible Interface and Remote Sense
Check for Samples: TPS62366A, TPS62366B
1
FEATURES
DESCRIPTION
The TPS62366x is a high-frequency synchronous
2
• 4A Peak Output Current
step down dc-dc converter optimized for battery-
• Highest Efficiency:
powered portable applications for a small solution
– Low R
DS,on
Switch and Active Rectifier
size. With an input voltage range of 2.5V to 5.5V,
common battery technologies are supported. The
– Power Save Mode for Light Loads
device provides up to 4A peak load current, operating
• I
2
C High Speed Compatible Interface
at 2.5MHz typical switching frequency.
• Programmable Output Voltage for Digital
The device converts to an output voltage range of
Voltage Scaling
0.5V to 1.77V, programmable via I
2
C interface in
– 0.5V to 1.77V, 10mV Steps
10mV steps. Dedicated inputs allow fast voltage
• Excellent DC/AC Output Voltage Regulation
transition to address processor performance
operating points.
– Differential Load Sensing
The TPS62366x supports low-voltage DSPs and
– Precise DC Output Voltage Accuracy
processor cores in smart-phones and handheld
– DCS-Control™ Architecture for Fast and
computers including latest submicron processes. A
Precise Transient Regulation
dedicated hardware input pin allows simple
• Multiple Robust Operation/Protection
transitions to performance operating points and
Features:
retention modes of processors.
– Soft Start
The devices focus on a high output voltage accuracy.
– Programmable Slew Rate at Voltage
The differential sensing and the DCS-Control™
Transition architecture achieve precise static and dynamic,
transient output voltage regulation.
– Over Temperature Protection
The TPS62366x device offers high efficiency step
– Input Under Voltage Detection / Lock Out
down conversion. The area of highest efficiency is
• Available in 16-Bump, 2mm x 2mm NanoFree™
extended towards low output currents to increase the
Package
efficiency while the processor is operating in retention
• Low External Device Count: < 25mm
2
Solution
mode, as well as towards highest output currents
Size
increasing the battery on-time.
The robust architecture and multiple safety features
APPLICATIONS
allow perfect system integration.
• Application Processors and DSPs Power
The 2mm x 2mm package and the low number of
Supply
required external components lead to a tiny solution
• Dynamic Voltage Scaling, SmartReflex™
size of less than 25mm
2
.
Compliant Processor Supply
• Cell Phones, Smart Phones, Feature Phones
• Tablets, PDAs, MIDs, Netbooks
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DCS-Control, NanoFree, SmartReflex are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 8
- ・ Abmessungen des Paketumrisses on Seite 43 Seite 44 Seite 46 Seite 47
- ・ Teilenummerierungssystem on Seite 2
- ・ Markierungsinformationen on Seite 2 Seite 43 Seite 44
- ・ Blockdiagramm on Seite 9
- ・ Technische Daten on Seite 2
- ・ Anwendungsbereich on Seite 1 Seite 49
- ・ Elektrische Spezifikation on Seite 4 Seite 5
