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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25CEC
Rev. 3, 04/2010
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
© Freescale Semiconductor, Inc., 2010. All rights reserved.
1 Introduction
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM926EJ-S core, with speeds of up to 400 MHz.
The i.MX25 includes support for up to 133-MHz
DDR2 memory, integrated 10/100 Ethernet MAC,
and two on-chip USB PHYs. The device is suitable
for a wide range of applications, including the
following:
• Graphical remote controls
• Human machine interface (HMI)
• Residential and commercial control panels
• Residential gateway (smart metering)
• Handheld scanners and printers
i.MX25 Applications
Processor for Consumer
and Industrial Products
Silicon Version 1.1
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 17
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 42
4. Package Information and Contact Assignment . . . . . . 123
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 123
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 124
4.3. Signal Contact Assignments—17x17 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 129
4.5. 347 MAPBGA—Case 12x12 mm,
0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 133
4.7. Signal Contact Assignments—12x12 mm,
0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 137
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MCIMX253DVM4, MCIMX257DVM4, MCIMX253CVM4, MCIMX257CVM4,
and MCIMX258CVM4.
Verzeichnis
- ・ Abmessungen des Paketumrisses on Seite 9 Seite 123
- ・ Teilenummerierungssystem on Seite 3
- ・ Blockdiagramm on Seite 5
- ・ Technische Daten on Seite 11 Seite 56 Seite 96 Seite 97 Seite 98
- ・ Anwendungsbereich on Seite 2 Seite 3 Seite 4 Seite 5 Seite 6
- ・ Elektrische Spezifikation on Seite 11 Seite 20 Seite 21 Seite 22 Seite 23
- ・ Teilenummernliste on Seite 11
