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© Freescale Semiconductor, Inc., 2005–2008. All rights reserved.
Freescale Semiconductor
Data Sheet: Technical Data
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Document Number: MCIMX31_5
Rev. 4.3, 12/2009
MCIMX31 and
MCIMX31L
Package Information
Plastic Package
Case 1581 14 x 14 mm, 0.5 mm Pitch
Case 1931 19 x 19 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The MCIMX31 and MCIMX31L multimedia
applications processors represent the next step in
low-power, high-performance application processors.
Unless otherwise specified, the material in this data sheet
is applicable to both the MCIMX31 and MCIMX31L
processors and referred to singularly throughout this
document as MCIMX31. The MCIMX31L does not
include a graphics processing unit (GPU).
Based on an ARM11™ microprocessor core, the
MCIMX31 provides the performance with low power
consumption required by modern digital devices.
The MCIMX31 takes advantage of the
ARM1136JF-S™ core running at up to 532 MHz, and is
optimized for minimal power consumption using the
most advanced techniques for power saving (DPTC,
DVFS, power gating, clock gating). With 90 nm
technology and dual-Vt transistors (two threshold
voltages), the MCIMX31 provides the optimal
performance versus leakage current balance.
The performance of the MCIMX31 is boosted by a
multi-level cache system, and features peripheral devices
MCIMX31 and
MCIMX31L
Multimedia Applications
Processors
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering Information . . . . . . . . . . . . . . . . . . . . 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description and Application
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ARM11 Microprocessor Core . . . . . . . . . . . . . . 4
Module Inventory. . . . . . . . . . . . . . . . . . . . . . . . 6
Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . 9
Electrical Characteristics . . . . . . . . . . . . . . . . 10
Chip-Level Conditions . . . . . . . . . . . . . . . . . . 10
Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . 18
Module-Level Electrical Specifications . . . . . . 20
Package Information and Pinout . . . . . . . . . 103
MAPBGA Production Package—457 14 x 14 mm,
0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . 103
MAPBGA Production Package—473 19 x 19 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . 109
Ball Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Product Documentation . . . . . . . . . . . . . . . . 117
Revision History . . . . . . . . . . . . . . . . . . . . . . . 117
Verzeichnis
- ・ Abmessungen des Paketumrisses on Seite 9 Seite 105 Seite 106 Seite 107 Seite 108
- ・ Teilenummerierungssystem on Seite 3
- ・ Blockdiagramm on Seite 4
- ・ Beschreibung der Funktionen on Seite 4 Seite 5 Seite 6 Seite 7 Seite 8
- ・ Technische Daten on Seite 2 Seite 3 Seite 4 Seite 5 Seite 6
- ・ Elektrische Spezifikation on Seite 10 Seite 11 Seite 12 Seite 13 Seite 14
