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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SXCEC
Rev. 3, 09/2017
MCIMX6XxExxxxxB
MCIMX6XxExxxxxC
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
© 2015-2017 NXP B.V.
1 Introduction
The i.MX 6SoloX processors represent NXP
Semiconductor’s latest achievement in integrated
multimedia-focused products offering high performance
processing with a high degree of functional integration,
targeted towards the growing market of connected
devices.
The i.MX 6SoloX processor features NXP’s advanced
implementation of the single ARM
®
Cortex
®
-A9 core,
which operates at speeds of up to 1 GHz, in addition to
the ARM Cortex-M4 core, which operates at speeds of
up to 227 MHz. This type of heterogeneous multicore
architecture provides greater levels of system
integration, smart low-power system awareness, and fast
real-time responsiveness. The i.MX 6SoloX includes a
GPU processor capable of supporting 2D and 3D
operations, a wide range of display and connectivity
options, and integrated power management. Each
i.MX 6SoloX Applications
Processors for Consumer
Product
s
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Special Signal Considerations . . . . . . . . . . . . . . .20
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 22
4.2 Power Supplies Requirements and Restrictions . 35
4.3 Integrated LDO Voltage Regulator Parameters . .36
4.4 PLL Electrical Characteristics. . . . . . . . . . . . . . . . 38
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 39
4.6 I/O DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . 40
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 45
4.8 Output Buffer Impedance Parameters . . . . . . . . .48
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 51
4.10 Multi-mode DDR Controller (MMDC) . . . . . . . . . .63
4.11 General-Purpose Media Interface (GPMI) Timing 64
4.12 External Peripheral Interface Parameters . . . . . . 72
4.13 A/D Converter. . . . . . . . . . . . . . . . . . . . . . . . . . . 115
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 119
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . 119
5.2 Boot Device Interface Allocation . . . . . . . . . . . . 121
6 Package Information and Contact Assignments . . . . . 129
6.1 i.MX 6SoloX Signal Availability by Package. . . . 129
6.2 Signals with Different States During Reset and After
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
6.3 19x19 mm Package Information. . . . . . . . . . . . . 132
6.4 17x17 mm Package Information. . . . . . . . . . . . . 151
6.5 14x14 mm Package Information. . . . . . . . . . . . . 186
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Verzeichnis
- ・ Abmessungen des Paketumrisses on Seite 20 Seite 36 Seite 129 Seite 130 Seite 131
- ・ Teilenummerierungssystem on Seite 3 Seite 4 Seite 5
- ・ Blockdiagramm on Seite 10
- ・ Technische Daten on Seite 19 Seite 22 Seite 23 Seite 24 Seite 84
- ・ Anwendungsbereich on Seite 2 Seite 3 Seite 4 Seite 5 Seite 6
- ・ Elektrische Spezifikation on Seite 22 Seite 23 Seite 24 Seite 25 Seite 26
