0.10 – 0.25
(.004 – .010)
0° – 8°
G48 (SSOP) 0814 REV A
SEATING
PLANE
0.55 – 0.95**
(.022 – .037)
1.25
(.0492)
REF
5.00 – 5.60*
(.197 – .221)
7.40 – 8.20
(.291 – .323)
1 2 3 4
5
6
7
8 9 10 11 12 14 15 16 17 18 19 20 21 2223 2413
4445464748 43 42 41
40
39
38
37 36 35 34 33 31 30 29 28 27 26 2532
12.50 – 13.10*
(.492 – .516)
2.0
(.079)
MAX
1.65 – 1.85
(.065 – .073)
0.05
(.002)
MIN
0.50
(.01968)
BSC
0.20 – 0.315
†
(.008 – .0124)
TYP
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS,
BUT DO INCLUDE MOLD MISMATCH AND ARE MEASURED AT
THE PARTING LINE. MOLD FLASH SHALL NOT EXCEED .15mm PER SIDE
LENGTH OF LEAD FOR SOLDERRING TO A SUBSTRATE
THE MAXIMUM DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS DO NOT EXCEED 0.13mm PER SIDE
*
**
†
NOTE:
1.DRAWING IS NOT A JEDEC OUTLINE
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSIONS ARE IN
4. DRAWING NOT TO SCALE
5. FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE
0.25 ±0.05
PARTING
LINE
0.50
BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.25 ±0.12
G Package
48-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1887 Rev A)
