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User's Guide
SLVU744–August 2012
TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up
Converter In Chip Scale Packaging EVM
This user's guide describes the characteristics, operation, and use of the TPS6125xEVM-766 evaluation
module (EVM). This EVM enables test and evaluation of the Texas Instruments' TPS61253, TPS61258,
and TPS61259 devices, a series of 3.5-MHz, up to 5.1-V, step-up dc-dc converters. This user's guide
includes EVM specifications, the schematic diagram, bill of materials, and board layout.
Contents
1 Introduction .................................................................................................................. 2
2 TPS6125xEVM-766 Schematic ........................................................................................... 3
3 Connector and Test Point .................................................................................................. 4
4 Test Results ................................................................................................................. 5
5 TPS6125xEVM-766 Assembly Drawing and Layout ................................................................... 8
6 Bill of Materials ............................................................................................................. 13
List of Figures
1 TPS6125xEVM-766 Schematic ........................................................................................... 3
2 TPS61253 in Power Save Mode Operation with 40-mA load......................................................... 5
3 TPS61253 in PWM Operation with 260-mA Load...................................................................... 6
4 TPS61253 Load Transient from 100 mA to 300 mA ................................................................... 7
5 TPS61253 Load Transient from 100 mA to 500 mA ................................................................... 7
6 TPS6125xEVM-766 Component Placement (Viewed TOP) .......................................................... 8
7 TPS6125xEVM-766 Top Copper (Viewed from Top) .................................................................. 9
8 TPS6125xEVM-766 Inner Layer 1 (Viewed from Top) .............................................................. 10
9 PS6125xEVM-766 Inner Layer 2 (Viewed from Top)................................................................. 11
10 TPS6125xEVM-766 Bottom Copper (Viewed from Bottom) ........................................................ 12
List of Tables
1 Table 1. TPS6125xEVM-766 Output and Input Voltage Options and Ordering Information...................... 3
2 TPS6125xEVM-766 Bill of Materials.................................................................................... 13
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SLVU744–August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip
Scale Packaging EVM
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